● Inspection system Application: After stencil printing, pre/post reflow
oven, pre/post wave soldering, FPC etc |
● Stencil printing: Solder unavailability, insufficient or excessive
solder, solder misalignment, bridging, stain, scratch etc.
|
● Component defect: missing or excessive component,
misalignment, uneven, edging, opposite mounting, wrong or
bad component etc. |
● DIP: Missing parts, damage parts, offset, skew, inversion, etc |
● Soldering defect: excessive or missing solder, empty soldering,
bridging, solder ball, IC NG ,copper stain etc. |
● Calculation Method: Machine learning, color calculation, color
extraction, gray scale operation, image contrast. |
● Inspection mode: PCB fully covered, with array and bad marking
function. |
● SPC statistics function: Fully record the test data and make
analysis, with high flexibility to check production and quality
status. |
● Camera: 5 million pix full color high speed industrial digital
camera ,20 million pix camera optional. |
● Lens resolution: 10um/15um/18um/20um/25um, can be
custom-made.
Lighting source Annular stereo multi-channel
color light, RGB/RGBW/RGBR/RWBR optional. |
● Minimum component: 0201 chip, 0.3 pitch IC. |