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ND-800

The NeoDen ND800 inline AOI machine is a cutting-edge Automatic Optical Inspection solution designed to ensure quality and precision in PCB assembly. It is ideal for post-stencil printing, pre/post reflow oven, and wave soldering inspections, efficiently detecting defects such as solder misalignment, bridging, and missing components. Equipped with a high-speed industrial digital camera and advanced image processing algorithms, it provides accurate and reliable results. With support for flexible PCB sizes, thicknesses, and fine adjustment capabilities, it ensures enhanced precision. Its SPC statistics function fully records and analyzes test data, offering high flexibility to monitor production and quality status, making it compact, efficient, and suitable for modern manufacturing needs.

Features

● Inspection system Application: After stencil printing, pre/post reflow oven, pre/post wave soldering, FPC etc
● Stencil printing: Solder unavailability, insufficient or excessive solder, solder misalignment, bridging, stain, scratch etc.
● Component defect: missing or excessive component, misalignment, uneven, edging, opposite mounting, wrong or bad component etc.
● DIP: Missing parts, damage parts, offset, skew, inversion, etc
● Soldering defect: excessive or missing solder, empty soldering, bridging, solder ball, IC NG ,copper stain etc.
● Calculation Method: Machine learning, color calculation, color extraction, gray scale operation, image contrast.
● Inspection mode: PCB fully covered, with array and bad marking function.
● SPC statistics function: Fully record the test data and make analysis, with high flexibility to check production and quality status.
● Camera: 5 million pix full color high speed industrial digital camera ,20 million pix camera optional.
● Lens resolution: 10um/15um/18um/20um/25um, can be custom-made. Lighting source Annular stereo multi-channel color light, RGB/RGBW/RGBR/RWBR optional.
● Minimum component: 0201 chip, 0.3 pitch IC.

Technical Parameters

PCB Thickness : 0.3mm~5mm
Max. PCB Size (X x Y) : 400mm x 360mm
Min. PCB Size (Y x X) : 50mm x 50mm
Max. Bottom Gap : 75mm
Max. Top Gap : 35mm
Moving speed : 830mm/Sec(Max)
Transmission height from the ground : 900±20mm
Air pressure : 0.4 – 0.8MPa
PCB bending : <5mm or 3% of PCB Diagonal length
Power : AC220V, 50/60Hz, 1.5KW
Machine dimension : 980mm * 980mm * 1620mm
Weight : 550KG