The T-962 is a compact and efficient infrared reflow oven designed for soldering various SMD and BGA components. It features a user-friendly interface and automated soldering processes, ensuring consistent and high-quality results. With its precise temperature control and even heat distribution, it is suitable for small-scale production, prototyping, and rework tasks. Its ergonomic design and versatility make it a reliable choice for modern electronic manufacturing needs.
● Soldering Area: Effective soldering area of 180 × 235 mm, suitable for various PCB sizes. |
● Energy-Efficient Heating: Utilizes 800W infrared heating with air circulation for accurate and even temperature distribution. |
● Predefined Soldering Cycles: Offers eight pre-programmed soldering cycles for automated and efficient operation. |
● Compact and Lightweight Design: Small footprint and ergonomic build make it easy to position, transport, and store. |
● Versatile Functionality: Capable of soldering SMD, BGA, and other small electronic components, ideal for rework and small batch production. |
● User-Friendly Operation: Features a windowed drawer for safe handling and precise soldering techniques. |
No. of waves | : | 7 |
Heating type | : | Infrared IC Heater |
Maximum width of PCB board | : | 180mm x 235mm |
Power supply | : | 110VAC / 50Hz, 220VAC / 60Hz |
Peak power | : | 800W |
Cycle Time | : | 1~8 min |
Temperature Range | : | 0℃ - 280℃ |
Overall Dimensions | : | 30mm x 450mm |
Machine weight | : | 25Kgs |